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E&IT Department Odisha

@EIT_Odisha • 88,360 subscribers

Official Twitter handle of Electronics & Information Technology Department, Government of Odisha. All posts free for use under- CC by 4.0

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India's First Advanced 3D Glass Chip Packaging Unit Breaks Ground in Bhubaneswar tomorrow. Stay tuned..

India's First Advanced 3D Glass Chip Packaging Unit Breaks Ground in Bhubaneswar tomorrow. Stay tuned..

11,260 Aufrufe

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Government of Odisha signs an MoU with Sarvam AI for a $2.3 Billion Sovereign AI Hub hosting 25,000 GPUs

Government of Odisha signs an MoU with Sarvam AI for a $2.3 Billion Sovereign AI Hub hosting 25,000 GPUs

E&IT Department Odisha

203,207 Aufrufe • vor 4 Monaten

Exchange of MoU between Government of Odisha & Sarvam For establishment of Full-Stack Sovereign AI Park in Odisha

Exchange of MoU between Government of Odisha & Sarvam For establishment of Full-Stack Sovereign AI Park in Odisha

E&IT Department Odisha

33,737 Aufrufe • vor 4 Monaten

Two national firsts. Both in Odisha. 🇮🇳 ✅️ India's 1st Compound Semiconductor Fab ✅️ India's 1st Advanced 3D Chip Packaging Unit

Two national firsts. Both in Odisha. 🇮🇳 ✅️ India's 1st Compound Semiconductor Fab ✅️ India's 1st Advanced 3D Chip Packaging Unit

E&IT Department Odisha

10,515 Aufrufe • vor 2 Monaten

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