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E&IT Department Odisha

@EIT_Odisha • 88,360 subscribers

Official Twitter handle of Electronics & Information Technology Department, Government of Odisha. All posts free for use under- CC by 4.0

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India's First Advanced 3D Glass Chip Packaging Unit Breaks Ground in Bhubaneswar tomorrow. Stay tuned..

India's First Advanced 3D Glass Chip Packaging Unit Breaks Ground in Bhubaneswar tomorrow. Stay tuned..

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Government of Odisha signs an MoU with Sarvam AI for a $2.3 Billion Sovereign AI Hub hosting 25,000 GPUs

Government of Odisha signs an MoU with Sarvam AI for a $2.3 Billion Sovereign AI Hub hosting 25,000 GPUs

E&IT Department Odisha

203,207 просмотров • 4 месяцев назад

Exchange of MoU between Government of Odisha & Sarvam For establishment of Full-Stack Sovereign AI Park in Odisha

Exchange of MoU between Government of Odisha & Sarvam For establishment of Full-Stack Sovereign AI Park in Odisha

E&IT Department Odisha

33,737 просмотров • 4 месяцев назад

Two national firsts. Both in Odisha. 🇮🇳 ✅️ India's 1st Compound Semiconductor Fab ✅️ India's 1st Advanced 3D Chip Packaging Unit

Two national firsts. Both in Odisha. 🇮🇳 ✅️ India's 1st Compound Semiconductor Fab ✅️ India's 1st Advanced 3D Chip Packaging Unit

E&IT Department Odisha

10,515 просмотров • 2 месяцев назад

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