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Intel Foundry’s packaging technology continues to progress, with EMIB-T serving as the newest advancement this year. EMIB-T adds routing channels directly through tiny silicon bridges that connect different chips. By creating a more direct path for both energy and data, EMIB-T increases the efficiency and speed needed to power...

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Lip-Bu Tan with Jim Cramer on Mad Money Key Updates: 18A Execution Intel’s 18A yield is improving around 7–8% per month, which Tan described as the industry-standard scale-up rate. Defect-density targets were also reached ahead of year-end, supporting confidence in Panther Lake volume shipments. Foundry Customer Momentum Tan said outside customers are now knocking on Intel’s door after seeing the progress on 18A yield and defect density. He also said Intel has multiple customers engaged on 14A, with a 0.5 PDK already available. 14A Roadmap For 14A, Intel is targeting risk production in 2028 and volume production in 2029, putting it on an equal timeline with TSMC. EMIB / Advanced Packaging EMIB (which he called the best) and advanced packaging may be much bigger than expected …potentially billions, not just hundreds of millions. Some customers are even prepaying to help Intel secure tight supply-chain materials. Customer Demand Demand is accelerating too. Tan said one customer wanted to triple its forecast, but Intel needs a few quarters to catch up. Government Support Tan also said he updates President Trump and Howard Lutnick from time to time, and credited their support for understanding the strategic importance of U.S.-based semiconductor R&D, manufacturing, and capacity. Bottom line: The market can argue over candles. But the actual Intel story is execution, customers, packaging demand, and U.S. strategic backing all moving in the same direction. We don’t own enough $INTC

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