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Intel Foundry’s packaging technology continues to progress, with EMIB-T serving as the newest advancement this year. EMIB-T adds routing channels directly through tiny silicon bridges that connect different chips. By creating a more direct path for both energy and data, EMIB-T increases the efficiency and speed needed to power...

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Intel

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36,508 görüntüleme • 16 gün önce •via X (Twitter)

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The single-chip era is giving way to massive, interconnected systems. Intel's New Mexico advanced packaging fab is pushing the boundaries of what’s physically possible. By stacking chips using Foveros technology and interconnecting them with EMIB, Intel Foundry is scaling packages to 8x the industry’s reticle limit today—and 12x by 2028. U.S. leadership in advanced packaging is here. Watch:
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The single-chip era is giving way to massive, interconnected systems. Intel's New Mexico advanced packaging fab is pushing the boundaries of what’s physically possible. By stacking chips using Foveros technology and interconnecting them with EMIB, Intel Foundry is scaling packages to 8x the industry’s reticle limit today—and 12x by 2028. U.S. leadership in advanced packaging is here. Watch:

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Lip-Bu Tan with Jim Cramer on Mad Money Key Updates: 18A Execution Intel’s 18A yield is improving around 7–8% per month, which Tan described as the industry-standard scale-up rate. Defect-density targets were also reached ahead of year-end, supporting confidence in Panther Lake volume shipments. Foundry Customer Momentum Tan said outside customers are now knocking on Intel’s door after seeing the progress on 18A yield and defect density. He also said Intel has multiple customers engaged on 14A, with a 0.5 PDK already available. 14A Roadmap For 14A, Intel is targeting risk production in 2028 and volume production in 2029, putting it on an equal timeline with TSMC. EMIB / Advanced Packaging EMIB (which he called the best) and advanced packaging may be much bigger than expected …potentially billions, not just hundreds of millions. Some customers are even prepaying to help Intel secure tight supply-chain materials. Customer Demand Demand is accelerating too. Tan said one customer wanted to triple its forecast, but Intel needs a few quarters to catch up. Government Support Tan also said he updates President Trump and Howard Lutnick from time to time, and credited their support for understanding the strategic importance of U.S.-based semiconductor R&D, manufacturing, and capacity. Bottom line: The market can argue over candles. But the actual Intel story is execution, customers, packaging demand, and U.S. strategic backing all moving in the same direction. We don’t own enough $INTC
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Lip-Bu Tan with Jim Cramer on Mad Money Key Updates: 18A Execution Intel’s 18A yield is improving around 7–8% per month, which Tan described as the industry-standard scale-up rate. Defect-density targets were also reached ahead of year-end, supporting confidence in Panther Lake volume shipments. Foundry Customer Momentum Tan said outside customers are now knocking on Intel’s door after seeing the progress on 18A yield and defect density. He also said Intel has multiple customers engaged on 14A, with a 0.5 PDK already available. 14A Roadmap For 14A, Intel is targeting risk production in 2028 and volume production in 2029, putting it on an equal timeline with TSMC. EMIB / Advanced Packaging EMIB (which he called the best) and advanced packaging may be much bigger than expected …potentially billions, not just hundreds of millions. Some customers are even prepaying to help Intel secure tight supply-chain materials. Customer Demand Demand is accelerating too. Tan said one customer wanted to triple its forecast, but Intel needs a few quarters to catch up. Government Support Tan also said he updates President Trump and Howard Lutnick from time to time, and credited their support for understanding the strategic importance of U.S.-based semiconductor R&D, manufacturing, and capacity. Bottom line: The market can argue over candles. But the actual Intel story is execution, customers, packaging demand, and U.S. strategic backing all moving in the same direction. We don’t own enough $INTC

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Here are 20 companies that will dominate the AI age: 1/ ASML $ASML is revolutionizing the semiconductor industry by enabling chipmakers to produce the world’s most advanced processors with atomic-scale precision. Shrinking transistors to fit more power into smaller chips faces fundamental physical limits. The industry struggled with escalating costs, slower innovation cycles, and diminishing returns from older lithography methods. With $ASML, the process is radically different, its extreme ultraviolet (EUV) lithography machines use cutting-edge optics and physics to etch circuitry at the nanometer scale, enabling faster, more energy-efficient, and more powerful chips. This breakthrough is the backbone of progress in AI, cloud computing, smartphones, and virtually every advanced technology. As AI spreads to all aspects of our economies, an ever-growing number of chips is needed, driving demand for ASML machines and maintenance services.

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