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Elon Musk explains the biggest reason why Tesla and SpaceX is building a TerraFab: “What’s the limiting factor? We see the limiting factor as being able to make chips - both logic, memory and packaging” Today, the U.S. has zero high-volume computer memory fabs in production. New facilities are... show more

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Elon Musk says there isn’t a single high-volume computer memory fab operating in America today. “There’s one being built in Idaho by Micron, but it won’t reach volume production until around 2028.” “There are some being built in New York, but they’re expected in 2029 and 2030.” “Even under the best case assumptions of the memory makers and logic makers, it is not enough to meet the demand that is anticipated.” This is exactly why I believe the market is still underestimating the AI memory supercycle. As AI models become larger and AI agents and humanoid robots scale, memory won’t just be important, it will become one of the biggest bottlenecks.

Elon Musk says there isn’t a single high-volume computer memory fab operating in America today. “There’s one being built in Idaho by Micron, but it won’t reach volume production until around 2028.” “There are some being built in New York, but they’re expected in 2029 and 2030.” “Even under the best case assumptions of the memory makers and logic makers, it is not enough to meet the demand that is anticipated.” This is exactly why I believe the market is still underestimating the AI memory supercycle. As AI models become larger and AI agents and humanoid robots scale, memory won’t just be important, it will become one of the biggest bottlenecks.

Leopold Stock Tracker

50,604 görüntüleme • 3 ay önce

Elon Musk said Tesla will soon reveal the location and full plans for Terafab and the announcement will get its own dedicated spotlight: “Terafab is going to be an amazing initiative and a necessary one Without it, we will be constrained in our ability to scale Optimus production because we simply will not have enough AI chips We have to solve memory, logic and packaging in order to scale Optimus” Tesla has already placed equipment orders for a development fab in Austin that will bring: • Lithography mask production • Logic chips • Memory • Advanced packaging • Chip testing All under one roof This would allow Tesla to design a new AI chip, manufacture it, package it, test it and quickly iterate on the next version from the same facility A building like this does not exist anywhere else on Earth Terafab is not just another factory It is going to become the chip-development engine Tesla needs to scale Optimus and pursue high-risk, high-reward AI hardware breakthroughs at unprecedented speed

Elon Musk said Tesla will soon reveal the location and full plans for Terafab and the announcement will get its own dedicated spotlight: “Terafab is going to be an amazing initiative and a necessary one Without it, we will be constrained in our ability to scale Optimus production because we simply will not have enough AI chips We have to solve memory, logic and packaging in order to scale Optimus” Tesla has already placed equipment orders for a development fab in Austin that will bring: • Lithography mask production • Logic chips • Memory • Advanced packaging • Chip testing All under one roof This would allow Tesla to design a new AI chip, manufacture it, package it, test it and quickly iterate on the next version from the same facility A building like this does not exist anywhere else on Earth Terafab is not just another factory It is going to become the chip-development engine Tesla needs to scale Optimus and pursue high-risk, high-reward AI hardware breakthroughs at unprecedented speed

X Freeze

18,749 görüntüleme • 2 ay önce

Tesla and SpaceX have introduced an updated Terafab website along with a new rendering: "Tesla, SpaceX, and xAl are launching the most epic chip-building effort ever - combining logic, memory and advanced packaging under one roof. We aspire to be a galactic civilization." Website below:

Tesla and SpaceX have introduced an updated Terafab website along with a new rendering: "Tesla, SpaceX, and xAl are launching the most epic chip-building effort ever - combining logic, memory and advanced packaging under one roof. We aspire to be a galactic civilization." Website below:

Sawyer Merritt

604,115 görüntüleme • 6 ay önce

🇺🇸 AI is racing toward a wall no algorithm can break through. Global advanced chip production currently covers only 2–3% of what’s needed for Optimus-scale robotics and radiation-hardened orbital computing. Software can keep sprinting, but without a massive leap in manufacturing, logic, memory, and packaging under one roof, the next generation of AI and robots stays grounded. Hardware is the quiet crisis almost no one is shouting about. Writer: Val

🇺🇸 AI is racing toward a wall no algorithm can break through. Global advanced chip production currently covers only 2–3% of what’s needed for Optimus-scale robotics and radiation-hardened orbital computing. Software can keep sprinting, but without a massive leap in manufacturing, logic, memory, and packaging under one roof, the next generation of AI and robots stays grounded. Hardware is the quiet crisis almost no one is shouting about. Writer: Val

Mario Nawfal

45,782 görüntüleme • 2 ay önce

today, intel announced that it will join terafab. terafab started in march as a chip project in austin backed by tesla, spacex, and xai, with the goal of combining logic, memory, and advanced packaging to reach 1 terawatt of compute each year. that gives terafab deeper semiconductor capability as it pushes toward future ai, robotics, and space infrastructure.

today, intel announced that it will join terafab. terafab started in march as a chip project in austin backed by tesla, spacex, and xai, with the goal of combining logic, memory, and advanced packaging to reach 1 terawatt of compute each year. that gives terafab deeper semiconductor capability as it pushes toward future ai, robotics, and space infrastructure.

tetsuo

14,987 görüntüleme • 6 ay önce

The AI boom just hit a wall nobody saw coming. And it's not software. It's not regulation. It's not even energy... It's memory chips. Right now, Dell is raising PC prices by 30%. Intel can't ship chips. Nvidia is slashing GPU production by 40%. And almost nobody understands why. Here's the "hidden" crisis the AI industry is trying to hide: AI data centers are hoarding memory. Not GPUs. Not processors. MEMORY. Every AI server needs massive amounts of high-bandwidth memory (HBM) to run those models everyone's hyping. One problem: There are only 3 companies in the world that can make it. Samsung. SK Hynix. Micron. That's it. And all 3 just diverted their entire production capacity away from normal RAM to feed AI data centers. The math that breaks everything: 1 gigabyte of HBM takes 4X the manufacturing capacity of regular DRAM. AI will consume 20% of global DRAM production in 2026. But the thing is, consumer demand for RAM didn't disappear. PCs still need memory. Phones still need memory. Cars still need memory. But there's no capacity left to make it. The price explosion: RAM prices are up 246% in the last 6 months. DDR5 contract prices jumped 100% month-over-month in some cases. Dell's CFO said he's "never witnessed costs escalating at this pace." SK Hynix and Micron? Sold out through all of 2026. Micron straight up EXITED the consumer memory market entirely to focus on AI customers. If you're not building an AI data center, you're not getting memory chips. AI data centers pay 3-5X margins compared to consumer products. So memory manufacturers are rationally choosing: Serve Microsoft and Google's AI buildout, or serve Dell's laptop business? Easy choice. Every wafer allocated to an Nvidia H100 GPU is a wafer DENIED to your next laptop. It's a zero-sum game. And consumers are losing. The dangerous cascade effect: Nvidia is cutting RTX 50-series GPU production by 30-40% because they can't get GDDR7 memory. Dell, Lenovo, HP are all raising PC prices 15-30% in early 2026. Xiaomi and other smartphone makers are cutting shipment targets. Even Intel's crash last week? Partially driven by memory shortages limiting chip production. This is a PERMANENT reallocation of the world's silicon capacity. Not a temporary supply hiccup. For decades, consumer electronics (phones, PCs, laptops) drove memory production. Now? AI data centers are the priority customer. And that priority shift is reshaping the entire tech economy. The timeline Is worse than you think: Industry analysts project shortages lasting through 2027, maybe 2028. Why? Because building new memory fabs takes 3-5 YEARS. Micron's new Idaho fab won't meaningfully impact supply until 2028. Samsung and SK Hynix are too busy ramping up HBM4 production to expand consumer DRAM. So we're stuck. AI companies need memory to scale. But producing that memory DESTROYS the supply chain for everything else. My question here: Everyone's betting on AI scaling infinitely. But what if the AI boom STALLS because there's not enough memory to support it? What if we're not in an "AI supercycle" but a "memory shortage that kills the AI buildout"? Intel crashed 17% because they can't manufacture enough chips. The root cause though? Memory shortages limiting what they can even produce. Nvidia is cutting GPU production by 40%. AMD is struggling to get GDDR6 for Radeon cards. This isn't just a consumer problem. It's an AI infrastructure problem. And if memory doesn't scale, AI doesn't scale. The AI industry sold you on infinite scaling. But they forgot to mention the part where there's only 3 companies making the memory chips that power everything. And all 3 just chose AI data centers over you. Even Nvidia can't make enough GPUs to meet demand. Not because of energy. Not because of regulation... But because the memory supply chain is BROKEN. And it won't be fixed until 2028.

The AI boom just hit a wall nobody saw coming. And it's not software. It's not regulation. It's not even energy... It's memory chips. Right now, Dell is raising PC prices by 30%. Intel can't ship chips. Nvidia is slashing GPU production by 40%. And almost nobody understands why. Here's the "hidden" crisis the AI industry is trying to hide: AI data centers are hoarding memory. Not GPUs. Not processors. MEMORY. Every AI server needs massive amounts of high-bandwidth memory (HBM) to run those models everyone's hyping. One problem: There are only 3 companies in the world that can make it. Samsung. SK Hynix. Micron. That's it. And all 3 just diverted their entire production capacity away from normal RAM to feed AI data centers. The math that breaks everything: 1 gigabyte of HBM takes 4X the manufacturing capacity of regular DRAM. AI will consume 20% of global DRAM production in 2026. But the thing is, consumer demand for RAM didn't disappear. PCs still need memory. Phones still need memory. Cars still need memory. But there's no capacity left to make it. The price explosion: RAM prices are up 246% in the last 6 months. DDR5 contract prices jumped 100% month-over-month in some cases. Dell's CFO said he's "never witnessed costs escalating at this pace." SK Hynix and Micron? Sold out through all of 2026. Micron straight up EXITED the consumer memory market entirely to focus on AI customers. If you're not building an AI data center, you're not getting memory chips. AI data centers pay 3-5X margins compared to consumer products. So memory manufacturers are rationally choosing: Serve Microsoft and Google's AI buildout, or serve Dell's laptop business? Easy choice. Every wafer allocated to an Nvidia H100 GPU is a wafer DENIED to your next laptop. It's a zero-sum game. And consumers are losing. The dangerous cascade effect: Nvidia is cutting RTX 50-series GPU production by 30-40% because they can't get GDDR7 memory. Dell, Lenovo, HP are all raising PC prices 15-30% in early 2026. Xiaomi and other smartphone makers are cutting shipment targets. Even Intel's crash last week? Partially driven by memory shortages limiting chip production. This is a PERMANENT reallocation of the world's silicon capacity. Not a temporary supply hiccup. For decades, consumer electronics (phones, PCs, laptops) drove memory production. Now? AI data centers are the priority customer. And that priority shift is reshaping the entire tech economy. The timeline Is worse than you think: Industry analysts project shortages lasting through 2027, maybe 2028. Why? Because building new memory fabs takes 3-5 YEARS. Micron's new Idaho fab won't meaningfully impact supply until 2028. Samsung and SK Hynix are too busy ramping up HBM4 production to expand consumer DRAM. So we're stuck. AI companies need memory to scale. But producing that memory DESTROYS the supply chain for everything else. My question here: Everyone's betting on AI scaling infinitely. But what if the AI boom STALLS because there's not enough memory to support it? What if we're not in an "AI supercycle" but a "memory shortage that kills the AI buildout"? Intel crashed 17% because they can't manufacture enough chips. The root cause though? Memory shortages limiting what they can even produce. Nvidia is cutting GPU production by 40%. AMD is struggling to get GDDR6 for Radeon cards. This isn't just a consumer problem. It's an AI infrastructure problem. And if memory doesn't scale, AI doesn't scale. The AI industry sold you on infinite scaling. But they forgot to mention the part where there's only 3 companies making the memory chips that power everything. And all 3 just chose AI data centers over you. Even Nvidia can't make enough GPUs to meet demand. Not because of energy. Not because of regulation... But because the memory supply chain is BROKEN. And it won't be fixed until 2028.

Ricardo

594,643 görüntüleme • 8 ay önce

Terafab is starting to sound like a lot more than just a chip factory! Tesla and SpaceX are reportedly putting $16.8B into phase one, with plans to handle everything from chip design and fabrication to memory, packaging and testing. The idea is basically to bring pieces of what TSMC, Micron and NVIDIA do under one roof. And the chips could eventually power everything from Tesla cars and Optimus to SpaceX data centers and AI compute in space. $TSLA $SPCX

Terafab is starting to sound like a lot more than just a chip factory! Tesla and SpaceX are reportedly putting $16.8B into phase one, with plans to handle everything from chip design and fabrication to memory, packaging and testing. The idea is basically to bring pieces of what TSMC, Micron and NVIDIA do under one roof. And the chips could eventually power everything from Tesla cars and Optimus to SpaceX data centers and AI compute in space. $TSLA $SPCX

Herbert Ong

31,110 görüntüleme • 1 ay önce

Many still don’t understand why Elon is building Terafab Terafab is an extension to all the chip makers in the world It’s not about replacement, not a rivalry and absolutely not competing It’s being built to fulfill the massive chip orders that Tesla, SpaceX and xAI actually need TSMC’s most advanced 2nm capacity is totally booked through 2028 Tesla signed a massive $16.5 billion deal with Samsung back in July 2025 to produce AI6 chips at their Taylor, Texas factory and Samsung is building a Tesla Exclusive chip manufacturing plant to full fill this orders When Elon announced Terafab on March 21, 2026...he made it clear: “That rate is much less than we’d like. We either build the Terafab or we don’t have the chips, and we need the chips, so we build the Terafab” He basically told the chip makers: “Produce as much as you comfortably can. We will take them all. Actually we want even more” Even today Elon said: "SpaceX/Tesla will be always be major customers of TSMC and not competitors in the normal sense of the word" Current production rates are much less than they need....That’s why Terafab exists Terafab is an extension to every chip maker… not competition, not rivalry, absolutely not Even Intel has joined as a partner Even if chip supply improves, massive bottlenecks still exist with memory and advanced packaging You simply can't risk those supply chain breaks at this scale That’s why Terafab is being built to vertically integrate everything - chips, memory, advanced packaging all under one roof, targeting 1 terawatt of AI compute capacity per year This is a ludicrous amount of chips that no chipmaker currently produces at this scale. I don't think even TSMC and Samsung truly understand these numbers yet It’s about building the capacity the future actually demands

Many still don’t understand why Elon is building Terafab Terafab is an extension to all the chip makers in the world It’s not about replacement, not a rivalry and absolutely not competing It’s being built to fulfill the massive chip orders that Tesla, SpaceX and xAI actually need TSMC’s most advanced 2nm capacity is totally booked through 2028 Tesla signed a massive $16.5 billion deal with Samsung back in July 2025 to produce AI6 chips at their Taylor, Texas factory and Samsung is building a Tesla Exclusive chip manufacturing plant to full fill this orders When Elon announced Terafab on March 21, 2026...he made it clear: “That rate is much less than we’d like. We either build the Terafab or we don’t have the chips, and we need the chips, so we build the Terafab” He basically told the chip makers: “Produce as much as you comfortably can. We will take them all. Actually we want even more” Even today Elon said: "SpaceX/Tesla will be always be major customers of TSMC and not competitors in the normal sense of the word" Current production rates are much less than they need....That’s why Terafab exists Terafab is an extension to every chip maker… not competition, not rivalry, absolutely not Even Intel has joined as a partner Even if chip supply improves, massive bottlenecks still exist with memory and advanced packaging You simply can't risk those supply chain breaks at this scale That’s why Terafab is being built to vertically integrate everything - chips, memory, advanced packaging all under one roof, targeting 1 terawatt of AI compute capacity per year This is a ludicrous amount of chips that no chipmaker currently produces at this scale. I don't think even TSMC and Samsung truly understand these numbers yet It’s about building the capacity the future actually demands

X Freeze

53,291 görüntüleme • 5 ay önce

Elon: 'The Limiting Factor is Chips Now, Power in a Year' "It's not clear to me that there's enough usable electricity to turn on all the AI chips that are being made. Towards the end of this year, the chip output will exceed the ability to turn chips on. Whichever company can scale hardware the fastest will be the leader and XAI will be able to scale hardware the fastest." Source: Cheeky Pint Podcast

Elon: 'The Limiting Factor is Chips Now, Power in a Year' "It's not clear to me that there's enough usable electricity to turn on all the AI chips that are being made. Towards the end of this year, the chip output will exceed the ability to turn chips on. Whichever company can scale hardware the fastest will be the leader and XAI will be able to scale hardware the fastest." Source: Cheeky Pint Podcast

Mario Nawfal

2,737,999 görüntüleme • 8 ay önce

$MU is the only company right now fully positioned for the memory centric AI cycle. This will, without question, be one of the largest markets over the next 5 years high bandwidth memory, advanced packaging, and AI server demand are structurally exploding. And the market still hasn’t fully priced this in. $DELL is simultaneously capturing the AI infrastructure build out from servers to enterprise deployment with multi year visibility and backlog strength that most investors are still underestimating. I’ll be going down a rabbit hole on both MU and DELL this long weekend.

$MU is the only company right now fully positioned for the memory centric AI cycle. This will, without question, be one of the largest markets over the next 5 years high bandwidth memory, advanced packaging, and AI server demand are structurally exploding. And the market still hasn’t fully priced this in. $DELL is simultaneously capturing the AI infrastructure build out from servers to enterprise deployment with multi year visibility and backlog strength that most investors are still underestimating. I’ll be going down a rabbit hole on both MU and DELL this long weekend.

Bill Brooklyn

23,185 görüntüleme • 1 ay önce

ELON MUSK: "xAI will be the leader, we'll be able to turn on more chips than other people and faster, because we're good at hardware. The current limiting factor that I see in the sort of three to four year time frame is chips. In one day time it's the energy, power production, electricity. It's not clear to me that there's enough usable electricity to turn on all the AI chips that are being made, towards the end of this year. xAI will be able to scale hardware the fastest, and therefore most likely will be the leader."

ELON MUSK: "xAI will be the leader, we'll be able to turn on more chips than other people and faster, because we're good at hardware. The current limiting factor that I see in the sort of three to four year time frame is chips. In one day time it's the energy, power production, electricity. It's not clear to me that there's enough usable electricity to turn on all the AI chips that are being made, towards the end of this year. xAI will be able to scale hardware the fastest, and therefore most likely will be the leader."

DogeDesigner

52,128 görüntüleme • 8 ay önce

Does anyone realize that if SpaceX pulls this off, Terafab would become the largest building ever constructed by floor area? More than 100 million square feet of manufacturing space, over 5x the floor area of the current largest building on Earth. I wanted to wait before reporting because news was coming out quite rapidly after the until announcement. SpaceX and Tesla are planning to invest roughly $16.8 billion in the initial buildout in Grimes County, Texas. It will manufacture, package and test advanced logic and memory chips under one roof because their combined demand is expected to exceed 1 terawatt of compute, more than the current global supply. The buildout is already so massive that ASML, (the only supplier of the most advanced EUV lithography machines) is factoring Terafab demand into its own 2027 and 2028 capacity plans. Elon’s rough estimate is that 25% of its AI compute output will go toward Tesla Optimus and the other 75% toward AI spacecraft. ASML has to plan years in advance for the sheer amount of chipmaking capacity Elon wants for robots and ‘ai spacecraft’

Does anyone realize that if SpaceX pulls this off, Terafab would become the largest building ever constructed by floor area? More than 100 million square feet of manufacturing space, over 5x the floor area of the current largest building on Earth. I wanted to wait before reporting because news was coming out quite rapidly after the until announcement. SpaceX and Tesla are planning to invest roughly $16.8 billion in the initial buildout in Grimes County, Texas. It will manufacture, package and test advanced logic and memory chips under one roof because their combined demand is expected to exceed 1 terawatt of compute, more than the current global supply. The buildout is already so massive that ASML, (the only supplier of the most advanced EUV lithography machines) is factoring Terafab demand into its own 2027 and 2028 capacity plans. Elon’s rough estimate is that 25% of its AI compute output will go toward Tesla Optimus and the other 75% toward AI spacecraft. ASML has to plan years in advance for the sheer amount of chipmaking capacity Elon wants for robots and ‘ai spacecraft’

Chris

81,393 görüntüleme • 2 ay önce

SK Hynix's Hoshik Kim admits high bandwidth memory "is not the answer" to the memory-wall problem, and SK is working on different solutions to solve the bottleneck. "No, actually, I kind of agree with Pat. So HBM is not the answer." [SK Hynix is admitting that HBM is a bad memory?] "Nothing is a bad memory. It's a good memory, but it's not the final answer. So actually, HBM will not solve the memory-wall problem. Memory-wall problem is an inherent AI problem, which you cannot avoid." "So we try our best to provide higher bandwidth with this memory, with HBM technology even though it has some limitation, as Pat already mentioned, with thermal, IOs, cost, a lot of stuff. "But that's the only thing we got right now to help ease this memory-wall problem, memory-bottleneck problem. But at the same time, we are working in different directions to solve this memory-wall problem with different solutions."

SK Hynix's Hoshik Kim admits high bandwidth memory "is not the answer" to the memory-wall problem, and SK is working on different solutions to solve the bottleneck. "No, actually, I kind of agree with Pat. So HBM is not the answer." [SK Hynix is admitting that HBM is a bad memory?] "Nothing is a bad memory. It's a good memory, but it's not the final answer. So actually, HBM will not solve the memory-wall problem. Memory-wall problem is an inherent AI problem, which you cannot avoid." "So we try our best to provide higher bandwidth with this memory, with HBM technology even though it has some limitation, as Pat already mentioned, with thermal, IOs, cost, a lot of stuff. "But that's the only thing we got right now to help ease this memory-wall problem, memory-bottleneck problem. But at the same time, we are working in different directions to solve this memory-wall problem with different solutions."

Fireside Alpha

140,571 görüntüleme • 2 ay önce

$AMKR is hitting new ATHs after they announced a 10-year agreement with $TSM to expand advanced semiconductor packaging and testing capabilities in Arizona, strengthening the U.S. chip supply chain. The partnership aims to support growing AI and high-performance computing demand by increasing advanced packaging capacity and speeding time to market for customers.

$AMKR is hitting new ATHs after they announced a 10-year agreement with $TSM to expand advanced semiconductor packaging and testing capabilities in Arizona, strengthening the U.S. chip supply chain. The partnership aims to support growing AI and high-performance computing demand by increasing advanced packaging capacity and speeding time to market for customers.

Sam Badawi

30,821 görüntüleme • 3 ay önce

Elon Musk just described a project so large that most people will assume he is exaggerating (Save this). He is not. In the video, Musk lays out the central problem facing every AI company on earth, the entire global chip industry is on a path to produce roughly 100 gigawatts of AI compute per year. That sounds like a lot until you understand that his companies alone Tesla, SpaceX, and xAI will need orders of magnitude more than that. His answer is the TerraFab. It is a joint chip factory spanning 100 million square feet, ten times the size of Tesla's Gigafactory Texas announced in March 2026, with Grimes County, Texas commissioners approving the full scale facility site just last week. The goal is one full terawatt of AI compute output per year. For context, 1 terawatt is 1,000 gigawatts twice the current total electricity consumption of the United States. SpaceX has already committed an initial $55 billion to the prototype phase, with total investment estimates ranging into the trillions. Here is why this matters for Micron specifically. In the video, Musk named Nvidia's Rubin chips as the reference design for TerraFab's first orbital deployments, and said "You're going to need a lot of memory to go with that." A billion full radical equivalent chips per year, each requiring stacks of high bandwidth memory, that is the demand signal Micron just received from one of the most capital-intensive projects in human history. And Micron already cannot keep up with what exists today. Micron's entire 2026 HBM output is fully sold out contracted before the year began. HBM4 entered volume production ahead of schedule and sold out immediately. The structural reason Micron wins here is simple. Every AI chip ever built Nvidia H100s, Rubin chips, custom ASICs, TPUs is useless without high-bandwidth memory stacked directly on top of it. There are only three companies in the world that supply HBM at scale, Samsung, SK Hynix, and Micron. Samsung has had quality issues, SK Hynix is supply constrained. Micron is the only US headquartered HBM manufacturer which matters enormously given CHIPS Act subsidies, domestic procurement requirements, and the political push to keep critical AI memory production on American soil. TerraFab just made the memory deficit permanently larger. Come join Milk Road Pro for our full breakdown of Micron and our entire AI thesis just for $1. Link below!

Elon Musk just described a project so large that most people will assume he is exaggerating (Save this). He is not. In the video, Musk lays out the central problem facing every AI company on earth, the entire global chip industry is on a path to produce roughly 100 gigawatts of AI compute per year. That sounds like a lot until you understand that his companies alone Tesla, SpaceX, and xAI will need orders of magnitude more than that. His answer is the TerraFab. It is a joint chip factory spanning 100 million square feet, ten times the size of Tesla's Gigafactory Texas announced in March 2026, with Grimes County, Texas commissioners approving the full scale facility site just last week. The goal is one full terawatt of AI compute output per year. For context, 1 terawatt is 1,000 gigawatts twice the current total electricity consumption of the United States. SpaceX has already committed an initial $55 billion to the prototype phase, with total investment estimates ranging into the trillions. Here is why this matters for Micron specifically. In the video, Musk named Nvidia's Rubin chips as the reference design for TerraFab's first orbital deployments, and said "You're going to need a lot of memory to go with that." A billion full radical equivalent chips per year, each requiring stacks of high bandwidth memory, that is the demand signal Micron just received from one of the most capital-intensive projects in human history. And Micron already cannot keep up with what exists today. Micron's entire 2026 HBM output is fully sold out contracted before the year began. HBM4 entered volume production ahead of schedule and sold out immediately. The structural reason Micron wins here is simple. Every AI chip ever built Nvidia H100s, Rubin chips, custom ASICs, TPUs is useless without high-bandwidth memory stacked directly on top of it. There are only three companies in the world that supply HBM at scale, Samsung, SK Hynix, and Micron. Samsung has had quality issues, SK Hynix is supply constrained. Micron is the only US headquartered HBM manufacturer which matters enormously given CHIPS Act subsidies, domestic procurement requirements, and the political push to keep critical AI memory production on American soil. TerraFab just made the memory deficit permanently larger. Come join Milk Road Pro for our full breakdown of Micron and our entire AI thesis just for $1. Link below!

Milk Road AI

248,804 görüntüleme • 4 ay önce

$MU $00060 $00530 $TSM Evolution of the AI Memory Hierarchy: HBM, DRAM, & SRAM Overview and Market Analysis The video outlines the strategic shift of modern computing toward a memory-centric architecture driven by the demands of generative AI. It explains that the industry is moving away from a traditional commodity model to a tightly coupled hierarchy of specialized technologies, where High Bandwidth Memory (HBM) and advanced packaging act as primary bottlenecks for performance. Leading manufacturers like SK hynix, Samsung, and Micron are navigating complex transitions to HBM4 and CXL-based expansion to overcome data movement constraints. Beyond the memory producers, the ecosystem relies on integration enablers like TSMC for packaging and specialized equipment providers for high-precision manufacturing. Ultimately, the analysis suggests that memory intensity and power efficiency have become the decisive factors in the success of gigawatt-scale data centers.

$MU $00060 $00530 $TSM Evolution of the AI Memory Hierarchy: HBM, DRAM, & SRAM Overview and Market Analysis The video outlines the strategic shift of modern computing toward a memory-centric architecture driven by the demands of generative AI. It explains that the industry is moving away from a traditional commodity model to a tightly coupled hierarchy of specialized technologies, where High Bandwidth Memory (HBM) and advanced packaging act as primary bottlenecks for performance. Leading manufacturers like SK hynix, Samsung, and Micron are navigating complex transitions to HBM4 and CXL-based expansion to overcome data movement constraints. Beyond the memory producers, the ecosystem relies on integration enablers like TSMC for packaging and specialized equipment providers for high-precision manufacturing. Ultimately, the analysis suggests that memory intensity and power efficiency have become the decisive factors in the success of gigawatt-scale data centers.

TheValueist

23,901 görüntüleme • 9 ay önce

Elon Musk: Terafab is a Hedge Against Taiwan AND a Necessity to Scale Tesla/SpaceX david friedberg: “I'd love to hear the origin story of Terafab. What was the demand that made you say, we've got to do this, we've got to build this?” Elon Musk: “We're a little worried that maybe, at some point, chips from Taiwan would not be available for who knows what reason. @jason: “Could be any number of reasons.” Elon: “For some reason, at some point, chips may not continue coming here from Taiwan, and that would really make things difficult if we didn't have any chips. So that's an important reason to have Terafab. Then long term, there's just a scaling challenge where if you want to really scale AI, within server centers as well as for edge compute, for humanoid robotics and cars, you'd kind of run out of capacity with the existing fabs. As it is, all the fabs are running at max capacity, so there needs to be a certainty of future supply of chips even if things become challenging geopolitically. Even if they weren't challenging geopolitically, it's quite difficult to scale chip production. And you really need the logic, the memory, packaging, the whole works, in order to continue scaling. So it's either build Terafab or fail to scale.” ------------------------------ Thanks to our partners for making this possible! IREN is a vertically integrated AI Cloud platform, delivering data centers, compute and software for AI training and inference. Oracle connects the data, applications, and infrastructure that turn AI into business outcomes—with the flexibility, choice, and control to optimize as AI evolves. EY helps tech innovators scale from startup to exit to megacap. You build the future. We’ll handle the rest.

Elon Musk: Terafab is a Hedge Against Taiwan AND a Necessity to Scale Tesla/SpaceX david friedberg: “I'd love to hear the origin story of Terafab. What was the demand that made you say, we've got to do this, we've got to build this?” Elon Musk: “We're a little worried that maybe, at some point, chips from Taiwan would not be available for who knows what reason. @jason: “Could be any number of reasons.” Elon: “For some reason, at some point, chips may not continue coming here from Taiwan, and that would really make things difficult if we didn't have any chips. So that's an important reason to have Terafab. Then long term, there's just a scaling challenge where if you want to really scale AI, within server centers as well as for edge compute, for humanoid robotics and cars, you'd kind of run out of capacity with the existing fabs. As it is, all the fabs are running at max capacity, so there needs to be a certainty of future supply of chips even if things become challenging geopolitically. Even if they weren't challenging geopolitically, it's quite difficult to scale chip production. And you really need the logic, the memory, packaging, the whole works, in order to continue scaling. So it's either build Terafab or fail to scale.” ------------------------------ Thanks to our partners for making this possible! IREN is a vertically integrated AI Cloud platform, delivering data centers, compute and software for AI training and inference. Oracle connects the data, applications, and infrastructure that turn AI into business outcomes—with the flexibility, choice, and control to optimize as AI evolves. EY helps tech innovators scale from startup to exit to megacap. You build the future. We’ll handle the rest.

The All-In Podcast

43,073 görüntüleme • 22 gün önce

ELON: TESLA'S PEDAL TO THE METAL ON AI5 & AI6 "Tesla's pedal to the metal max production is to get Tesla AI5 chip design into production and then reaching scale, that'll probably happen around the second quarter of next year. AI6 would hopefully follow less than a year later. We've secured all the chip fab production that we can using TSMC Taiwan, Samsung Korea, TSMC Arizona, Samsung Texas. The limiting factor once you can get to space is chips, but the limiting factor before you can get to space will be power." Source: Cheeky Pint Podcast, Elon Musk

ELON: TESLA'S PEDAL TO THE METAL ON AI5 & AI6 "Tesla's pedal to the metal max production is to get Tesla AI5 chip design into production and then reaching scale, that'll probably happen around the second quarter of next year. AI6 would hopefully follow less than a year later. We've secured all the chip fab production that we can using TSMC Taiwan, Samsung Korea, TSMC Arizona, Samsung Texas. The limiting factor once you can get to space is chips, but the limiting factor before you can get to space will be power." Source: Cheeky Pint Podcast, Elon Musk

Mario Nawfal

72,185 görüntüleme • 8 ay önce

Wonder what 2.5D advanced packaging / CoWoS looks like? ASE showed off a super cool model in Taiwan that demonstrates the various components of an advanced package "XPU / GPU" and how it is bound together by CoWoS (Chip on wafer on substrate) Center piece is the XPU logic die which does the calculations - (largest volumes made by $NVDA and $AVGO) The piece surrounding it with many layers is HBM - high bandwidth memory (made by SK Hynix, $MU, and Samsung) They are packaged together with microbumps onto the copper colored RDL. Underneath, silver colored is the silicon interposer. Finally they are placed onto the substrate itself. This complex process of advanced packaging is done to create a combined chip that is able to access different capabilities at a very fast rate (in the case of the XPU, it's to access the high bandwidth memory faster). Note you can see that the shoreline of the XPU (aka closest to the logic die for fastest I/O) is dominated by HBM. Often times AI workloads are memory bandwidth constrained, aka the constraint on the system is how fast the XPU can read and write their calculations to memory Advanced packaging is here to stay and continue to grow as techniques will expand past just the leading edge AI accelerators like GPUs and XPUs. In fact, $TSM on their last earnings call doubled their view of their Foundry TAM from $115B to $250B when including packaging, testing, and mass making! TSMC, ASE, Amkor are the leaders today in advanced packaging. In fact, ASE who presented this model invented this 2.5D - what TSMC calls CoWoS in 2014 alongside AMD. Fascinating times for the semis industry

Wonder what 2.5D advanced packaging / CoWoS looks like? ASE showed off a super cool model in Taiwan that demonstrates the various components of an advanced package "XPU / GPU" and how it is bound together by CoWoS (Chip on wafer on substrate) Center piece is the XPU logic die which does the calculations - (largest volumes made by $NVDA and $AVGO) The piece surrounding it with many layers is HBM - high bandwidth memory (made by SK Hynix, $MU, and Samsung) They are packaged together with microbumps onto the copper colored RDL. Underneath, silver colored is the silicon interposer. Finally they are placed onto the substrate itself. This complex process of advanced packaging is done to create a combined chip that is able to access different capabilities at a very fast rate (in the case of the XPU, it's to access the high bandwidth memory faster). Note you can see that the shoreline of the XPU (aka closest to the logic die for fastest I/O) is dominated by HBM. Often times AI workloads are memory bandwidth constrained, aka the constraint on the system is how fast the XPU can read and write their calculations to memory Advanced packaging is here to stay and continue to grow as techniques will expand past just the leading edge AI accelerators like GPUs and XPUs. In fact, $TSM on their last earnings call doubled their view of their Foundry TAM from $115B to $250B when including packaging, testing, and mass making! TSMC, ASE, Amkor are the leaders today in advanced packaging. In fact, ASE who presented this model invented this 2.5D - what TSMC calls CoWoS in 2014 alongside AMD. Fascinating times for the semis industry

Clark Tang

161,238 görüntüleme • 2 yıl önce

Advanced Technology Chip Fab (ATFC) update from this week’s flight. A large section of the ground slab is being poured today over the yellow moisture barrier. Rebar is in place for more pours, the new tall crane is assembled and working the slab, and the last reinforced footings on the south end are still going in. This is the joint Tesla / SpaceX ATCF on the east side of Giga Texas and it is a ~490,000 sq ft research fab. Heavily vibration-isolated foundation (GeoPiers, pedestal piers, massive footings) because chip lithography can’t tolerate movement. It’s the prototype: logic, memory, packaging, and test under one roof so they can make a chip, test it, revise the mask, and repeat without shipping wafers. This is also the precursor to the much larger Terafab in Grimes County. Chips here are meant for Optimus, Cybercab, future Tesla vehicles, and SpaceX Starmind / orbital compute. Foundation work is moving fast.

Advanced Technology Chip Fab (ATFC) update from this week’s flight. A large section of the ground slab is being poured today over the yellow moisture barrier. Rebar is in place for more pours, the new tall crane is assembled and working the slab, and the last reinforced footings on the south end are still going in. This is the joint Tesla / SpaceX ATCF on the east side of Giga Texas and it is a ~490,000 sq ft research fab. Heavily vibration-isolated foundation (GeoPiers, pedestal piers, massive footings) because chip lithography can’t tolerate movement. It’s the prototype: logic, memory, packaging, and test under one roof so they can make a chip, test it, revise the mask, and repeat without shipping wafers. This is also the precursor to the much larger Terafab in Grimes County. Chips here are meant for Optimus, Cybercab, future Tesla vehicles, and SpaceX Starmind / orbital compute. Foundation work is moving fast.

Joe Tegtmeyer 🚀 🤠🛸😎

29,018 görüntüleme • 20 gün önce