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The mind-blowing tech behind microchip manufacturing. Lasers fire 50,000 times per second at tin droplets moving 100 m/s, creating extreme ultraviolet light plasma — and that’s just one step inside ASML’s chip-making machine.

88,207 views • 1 year ago •via X (Twitter)

18 Comments

Science Guy's profile picture
Science Guy1 year ago

Each ASML extreme ultraviolet (EUV) lithography machine contains over 100,000 individual parts, costs around $400 million, and is the most complex device ever built by humans even more intricate than a space shuttle. The mirrors inside (made by Zeiss in Germany) are so smooth that if they were the size of the United States, the tallest bump would be only 1 millimeter high. And that tin-droplet laser trick? It produces light with a wavelength of 13.5 nanometers so short that ordinary glass would absorb it, meaning the entire system must operate in a vacuum with atomic precision alignment. Every microchip in your phone, computer, or AI server ultimately owes its existence to these laser-fired droplets of molten tin.

RandyT's profile picture
RandyT1 year ago

Source:

The Gal's profile picture
The Gal1 year ago

Yep, I used to work for them.

JC's profile picture
JC1 year ago

I’m convinced this is alien technology. 🤷🏻‍♂️

Loop's profile picture
Loop1 year ago

ASML’s EUV machines use lasers firing 50,000× per second at tin droplets to create plasma that etches nanometer scale circuits each chip involves billions of precise operations, showing just how extreme semiconductor manufacturing really is

Catalina Castro's profile picture
Catalina Castro1 year ago

The level of precision here is astounding. Also... a single point of failure.

JETLAB-X's profile picture
JETLAB-X1 year ago

Wow 😳👍🏽

Kole's profile picture
Kole1 year ago

Wow

Alberto Yépiz's profile picture
Alberto Yépiz1 year ago

How they can create 3nm o less with UV light 13nm ? Or there are new lasers from 2nm? @grok

ULTRA's profile picture
ULTRA1 year ago

What

mewc's profile picture
mewc1 year ago

Mindblowing

Rajesh M's profile picture
Rajesh M1 year ago

Truly amazing

Basic's profile picture
Basic1 year ago

nuts

Fleur Grove's profile picture
Fleur Grove1 year ago

ASML, c’est du futur en barre ! Si seulement on pouvait lâcher les sudoku administratifs en France et passer aux lasers 😅🤖.

kushyphus's profile picture
kushyphus1 year ago

@elonmusk from first principles should this be this complicated? @grok

Clausius's profile picture
Clausius1 year ago

@grok Curious who actually came up with the design of EUV machine?

Cornelis van der Bent's profile picture
Cornelis van der Bent1 year ago

Watch this great documentary if you want to know how ASML works.

deathmage.x .edge🦭's profile picture
deathmage.x .edge🦭1 year ago

wild to think this powers AI

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ACCELERATOR-BASED LITHOGRAPHY AND THE INDUCTION STORAGE RING LIGHT SOURCE The future of chipmaking may look less like a factory and more like a power grid. The proposed “Terafab” paradigm reimagines semiconductor manufacturing at utility scale: chip design, wafer fabrication, EUV lithography, memory, advanced packaging, and testing all under one roof, with the ambition of producing more than one terawatt of AI compute capacity per year. Its most radical innovation is treating light as a utility. Today, each EUV scanner relies on its own laser-produced plasma source, firing lasers at molten tin to generate 13.5 nm light. The process is inefficient, intensely hot, debris-heavy, and difficult to scale. Terafab replaces those individual sources with centralized, accelerator-driven free-electron lasers capable of distributing multi-kilowatt EUV light across an entire network of scanners. The advantages could be transformative: • No tin contamination or destructive plasma debris • Higher efficiency through electron-beam energy recovery • Greater photon flux to suppress stochastic defects at sub-3 nm nodes • Redundant accelerators that keep scanners operating during maintenance • Tunable wavelengths, potentially enabling 6.x nm “Beyond EUV” lithography THAT LAST POINT MATTERS ENORMOUSLY Conventional EUV is locked to the atomic emission of tin. Free-electron lasers are not. Their wavelength can be tuned through the energy of the electron beam creating a possible path beyond today’s 13.5 nm limit. If realized, Terafab would represent more than a larger semiconductor plant. It would transform lithography from a collection of isolated tools into shared industrial infrastructure. The next era of chipmaking may not be defined by a better machine. It may be defined by an entirely new architecture for manufacturing intelligence at civilization scale.

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