
Lukas Henkel
@QVHenkel • 25,530 subscribers
All things 3D | Rendering | Simulation | Electronics | StartUp | CEO engineering services company - views are my own
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On many high-speed designs it is necessary to have a ground-plane void underneath large pads to minimize the local impedance dip. I´ve used GPT-6 to create a script that reads the layerstack information through the Altium PCB API, isolate the target net- and pad class, creates an openEMS simulation, run the simulation to find the pad void size that does not create an impedance dip compared to the trace that is attached to the pad and ultimately apply the calculated GND void expansion value to all pads in a user-defined net class. Currently all pads still receive the same expansion value. I will port the setup to use palace EM in order to automatically solve the expansion values for all different pad sizes/shapes in parallel which should be much faster than openEMS.
Lukas Henkel39,693 views • 1 month ago

I´m experimenting with using ultrasonic surface waves on the trackpad of the laptop project to enable multi-touch haptic feedback. This should make it possible to generate haptic feedback under individual fingers for multi-touch gestures. Elmer FEM software is a really helpful tool to model the interface between the piezo elements and the coverglass as well as the wave propagation. Best of all it is open-source 😁
Lukas Henkel42,320 views • 2 years ago

Some chip manufacturers use selectively depopulated BGAs, but do not provide pin coordinates that can be conveniently imported. For such cases I like to use a transparent always-on-top overlay of the datasheet. It's worked great so far, but I'm still wondering if there's an easier way.
Lukas Henkel19,319 views • 1 year ago
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