Intel Foundry’s packaging technology continues to progress, with EMIB-T serving as the newest advancement this year. EMIB-T adds routing channels directly through tiny silicon bridges that connect different chips. By creating a more direct path for both energy and data, EMIB-T increases the efficiency and speed needed to power... today’s largest AI engines.show more

Yes

@imnotharsh $INTC STRONG BUY LONG $5T ⚠️⚠️⚠️

The new projects connect your planning directly to the work your teams. Are doing and flexibly adapt to whatever your team needs at any point. Built like a spreadsheet, project tables give you a life canvas to filter, sort, and group issues and pull requests.

EMIB-T pushing routing directly through silicon bridges shows how the industry is optimizing for faster data movement and lower power overhead. That’s critical for scaling large AI workloads.

Cool

@grok cool Je suis team intel depuis que mon premier pc était eeepc de asus avec le celron et donc j'ai la croissance et la qualité et la robustesse de INTEL !

When Zen premiered they called chiplets, "gluing together a processor" then hired the guy at AMD responsible for chiplets.

Intel change the world

Market Chatter: What is this? why are you going to India instead of the US with these 1,800 jobs? 09:30 AM EDT, 05/29/2026 (MT Newswires) -- Intel (INTC) and 3DGS will invest about $3.3 billion to establish a semiconductor substrate manufacturing facility in India.

This tech gets me excited, along with concepts like Cerebras wafer scale. Hope to see some Intel & Cerebras collaboration in the future, 2 disruptors taking down the mammoths.

I love Intel. Love INTC

Silicon bridges with direct routing. This is exactly the packaging breakthrough we need for AI hardware to scale. I believe we are seeing a new era of chip manufacturing begin 🚀

We love this attitude and see EMIB-T as a core part of how Intel is delivering the bandwidth and efficiency next‑gen AI workloads demand.

We stand at the beginning of a new era for high-performance silicon. EMIB-T proves advanced packaging is now the decisive factor for AI performance. 🚀