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The single-chip era is giving way to massive, interconnected systems. Intel's New Mexico advanced packaging fab is pushing the boundaries of what’s physically possible. By stacking chips using Foveros technology and interconnecting them with EMIB, Intel Foundry is scaling packages to 8x the industry’s reticle limit today—and 12x by... show more

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18,932 views • 5 months ago •via X (Twitter)

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AI needs the "brain power" of multiple chips. At Fab 9 in New Mexico, Intel Foundry creates systems of chips using Foveros 3D stacking to optimize space for laptops to be thinner with longer lasting batteries. 💻 Watch how Foveros is created 👇

AI needs the "brain power" of multiple chips. At Fab 9 in New Mexico, Intel Foundry creates systems of chips using Foveros 3D stacking to optimize space for laptops to be thinner with longer lasting batteries. 💻 Watch how Foveros is created 👇

Intel

41,457 views • 4 months ago

New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB. Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS. - Three CoWOS flavors: silicon, organic RDL, local bridges - EMIB embeds tiny bridges into the substrate, no interposer - EMIB-T and EMIB-M add through-silicon vias and power capacitors - Google is booking 3M TPUs on EMIB via MediaTek by 2028 - Package sizes keep climbing: 5.5x reticle today, 40x ahead Chapters: (0:00) "There Is No Chip Without the Packaging" (0:28) Intro and SpaceX IPO Day (5:15) What We're Covering: CoWOS, EMIB, Google (7:40) Simple Packaging: Wire Bonds to Flip Chip (17:07) What Makes Packaging "Advanced" (33:44) CoWOS: Three Flavors Explained (45:30) EMIB: Intel's Embedded Bridge Approach (52:47) EMIB-T and EMIB-M (57:31) CoWOS vs. EMIB Trade-offs (1:02:18) Google's 3M TPU EMIB Order Austin Lyons Vikram Sekar

New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB. Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS. - Three CoWOS flavors: silicon, organic RDL, local bridges - EMIB embeds tiny bridges into the substrate, no interposer - EMIB-T and EMIB-M add through-silicon vias and power capacitors - Google is booking 3M TPUs on EMIB via MediaTek by 2028 - Package sizes keep climbing: 5.5x reticle today, 40x ahead Chapters: (0:00) "There Is No Chip Without the Packaging" (0:28) Intro and SpaceX IPO Day (5:15) What We're Covering: CoWOS, EMIB, Google (7:40) Simple Packaging: Wire Bonds to Flip Chip (17:07) What Makes Packaging "Advanced" (33:44) CoWOS: Three Flavors Explained (45:30) EMIB: Intel's Embedded Bridge Approach (52:47) EMIB-T and EMIB-M (57:31) CoWOS vs. EMIB Trade-offs (1:02:18) Google's 3M TPU EMIB Order Austin Lyons Vikram Sekar

Semi Doped

66,895 views • 2 months ago

$AMKR is hitting new ATHs after they announced a 10-year agreement with $TSM to expand advanced semiconductor packaging and testing capabilities in Arizona, strengthening the U.S. chip supply chain. The partnership aims to support growing AI and high-performance computing demand by increasing advanced packaging capacity and speeding time to market for customers.

$AMKR is hitting new ATHs after they announced a 10-year agreement with $TSM to expand advanced semiconductor packaging and testing capabilities in Arizona, strengthening the U.S. chip supply chain. The partnership aims to support growing AI and high-performance computing demand by increasing advanced packaging capacity and speeding time to market for customers.

Sam Badawi

30,821 views • 2 months ago

.bubble boi's new thesis for Intel is all about advanced packaging, which he says is the new Moore's Law: "Up until this point, Intel's thesis was really a fab turnaround." "Now, I've completely changed my logic. It's about advanced packaging. Advanced packaging to me is the new Moore's Law." "You've kind of already seen this with Vera Rubin, where they can't actually do four dies on one package. They had to change that at the last second." "If you look out to Feynman, the packaging of silicon is a huge bottleneck." "It already was a bottleneck. In 2025, Nvidia was 60% of TSMC's advanced packaging. So everyone else was out there to fend for themselves." "So any kind of advanced packaging that comes to market, that allows people to scale compute way more than I think just shrinking a node does. I mean, shrinking a node's great, but the way Nvidia's timeline — and I think all the hyperscalers as well — [has gone], they want more HBM, they want more radical-sized dies, and they all want it in one package." "That's really where things are headed towards, and I think the market's not pricing that in. I think this is a real sea change to the semi industry."

.bubble boi's new thesis for Intel is all about advanced packaging, which he says is the new Moore's Law: "Up until this point, Intel's thesis was really a fab turnaround." "Now, I've completely changed my logic. It's about advanced packaging. Advanced packaging to me is the new Moore's Law." "You've kind of already seen this with Vera Rubin, where they can't actually do four dies on one package. They had to change that at the last second." "If you look out to Feynman, the packaging of silicon is a huge bottleneck." "It already was a bottleneck. In 2025, Nvidia was 60% of TSMC's advanced packaging. So everyone else was out there to fend for themselves." "So any kind of advanced packaging that comes to market, that allows people to scale compute way more than I think just shrinking a node does. I mean, shrinking a node's great, but the way Nvidia's timeline — and I think all the hyperscalers as well — [has gone], they want more HBM, they want more radical-sized dies, and they all want it in one package." "That's really where things are headed towards, and I think the market's not pricing that in. I think this is a real sea change to the semi industry."

TBPN

75,325 views • 4 months ago

Pushing the boundaries of what’s possible. The Air Force Research Lab - AFRL is creating seamless #partnerships between pilots and autonomous systems through tech that can understand and adapt to human intent, allowing the U.S. to stay ahead of the #technology hype curve.

Pushing the boundaries of what’s possible. The Air Force Research Lab - AFRL is creating seamless #partnerships between pilots and autonomous systems through tech that can understand and adapt to human intent, allowing the U.S. to stay ahead of the #technology hype curve.

Armed with Science

23,416 views • 1 year ago

Elon Musk explains the biggest reason why Tesla and SpaceX is building a TerraFab: “What’s the limiting factor? We see the limiting factor as being able to make chips - both logic, memory and packaging” Today, the U.S. has zero high-volume computer memory fabs in production. New facilities are coming, but they won't reach meaningful scale until 2028–2030......far behind the pace AI demand is growing Without enough semiconductors, AI and robotics eventually hit a physical wall TerraFab is designed to attack that bottleneck directly...bringing logic, memory and advanced packaging under one roof

Elon Musk explains the biggest reason why Tesla and SpaceX is building a TerraFab: “What’s the limiting factor? We see the limiting factor as being able to make chips - both logic, memory and packaging” Today, the U.S. has zero high-volume computer memory fabs in production. New facilities are coming, but they won't reach meaningful scale until 2028–2030......far behind the pace AI demand is growing Without enough semiconductors, AI and robotics eventually hit a physical wall TerraFab is designed to attack that bottleneck directly...bringing logic, memory and advanced packaging under one roof

X Freeze

14,529 views • 28 days ago

Many still don’t understand why Elon is building Terafab Terafab is an extension to all the chip makers in the world It’s not about replacement, not a rivalry and absolutely not competing It’s being built to fulfill the massive chip orders that Tesla, SpaceX and xAI actually need TSMC’s most advanced 2nm capacity is totally booked through 2028 Tesla signed a massive $16.5 billion deal with Samsung back in July 2025 to produce AI6 chips at their Taylor, Texas factory and Samsung is building a Tesla Exclusive chip manufacturing plant to full fill this orders When Elon announced Terafab on March 21, 2026...he made it clear: “That rate is much less than we’d like. We either build the Terafab or we don’t have the chips, and we need the chips, so we build the Terafab” He basically told the chip makers: “Produce as much as you comfortably can. We will take them all. Actually we want even more” Even today Elon said: "SpaceX/Tesla will be always be major customers of TSMC and not competitors in the normal sense of the word" Current production rates are much less than they need....That’s why Terafab exists Terafab is an extension to every chip maker… not competition, not rivalry, absolutely not Even Intel has joined as a partner Even if chip supply improves, massive bottlenecks still exist with memory and advanced packaging You simply can't risk those supply chain breaks at this scale That’s why Terafab is being built to vertically integrate everything - chips, memory, advanced packaging all under one roof, targeting 1 terawatt of AI compute capacity per year This is a ludicrous amount of chips that no chipmaker currently produces at this scale. I don't think even TSMC and Samsung truly understand these numbers yet It’s about building the capacity the future actually demands

Many still don’t understand why Elon is building Terafab Terafab is an extension to all the chip makers in the world It’s not about replacement, not a rivalry and absolutely not competing It’s being built to fulfill the massive chip orders that Tesla, SpaceX and xAI actually need TSMC’s most advanced 2nm capacity is totally booked through 2028 Tesla signed a massive $16.5 billion deal with Samsung back in July 2025 to produce AI6 chips at their Taylor, Texas factory and Samsung is building a Tesla Exclusive chip manufacturing plant to full fill this orders When Elon announced Terafab on March 21, 2026...he made it clear: “That rate is much less than we’d like. We either build the Terafab or we don’t have the chips, and we need the chips, so we build the Terafab” He basically told the chip makers: “Produce as much as you comfortably can. We will take them all. Actually we want even more” Even today Elon said: "SpaceX/Tesla will be always be major customers of TSMC and not competitors in the normal sense of the word" Current production rates are much less than they need....That’s why Terafab exists Terafab is an extension to every chip maker… not competition, not rivalry, absolutely not Even Intel has joined as a partner Even if chip supply improves, massive bottlenecks still exist with memory and advanced packaging You simply can't risk those supply chain breaks at this scale That’s why Terafab is being built to vertically integrate everything - chips, memory, advanced packaging all under one roof, targeting 1 terawatt of AI compute capacity per year This is a ludicrous amount of chips that no chipmaker currently produces at this scale. I don't think even TSMC and Samsung truly understand these numbers yet It’s about building the capacity the future actually demands

X Freeze

53,291 views • 4 months ago

$INTC has emerged as one of 2026’s biggest AI winners by benefiting across Xeon CPUs, purpose-built silicon and advanced packaging. That exposure is expanding because every accelerator rack still needs general-purpose compute to manage data, storage and workloads making agentic AI a new growth driver for server CPUs. The same buildout is pulling Intel deeper into custom silicon which nearly tripled YoY to a ~$2B annual run rate and advanced packaging where management already sees billions in backlog potential.

$INTC has emerged as one of 2026’s biggest AI winners by benefiting across Xeon CPUs, purpose-built silicon and advanced packaging. That exposure is expanding because every accelerator rack still needs general-purpose compute to manage data, storage and workloads making agentic AI a new growth driver for server CPUs. The same buildout is pulling Intel deeper into custom silicon which nearly tripled YoY to a ~$2B annual run rate and advanced packaging where management already sees billions in backlog potential.

Shay Boloor

51,195 views • 1 month ago

Lip-Bu Tan with Jim Cramer on Mad Money Key Updates: 18A Execution Intel’s 18A yield is improving around 7–8% per month, which Tan described as the industry-standard scale-up rate. Defect-density targets were also reached ahead of year-end, supporting confidence in Panther Lake volume shipments. Foundry Customer Momentum Tan said outside customers are now knocking on Intel’s door after seeing the progress on 18A yield and defect density. He also said Intel has multiple customers engaged on 14A, with a 0.5 PDK already available. 14A Roadmap For 14A, Intel is targeting risk production in 2028 and volume production in 2029, putting it on an equal timeline with TSMC. EMIB / Advanced Packaging EMIB (which he called the best) and advanced packaging may be much bigger than expected …potentially billions, not just hundreds of millions. Some customers are even prepaying to help Intel secure tight supply-chain materials. Customer Demand Demand is accelerating too. Tan said one customer wanted to triple its forecast, but Intel needs a few quarters to catch up. Government Support Tan also said he updates President Trump and Howard Lutnick from time to time, and credited their support for understanding the strategic importance of U.S.-based semiconductor R&D, manufacturing, and capacity. Bottom line: The market can argue over candles. But the actual Intel story is execution, customers, packaging demand, and U.S. strategic backing all moving in the same direction. We don’t own enough $INTC

Lip-Bu Tan with Jim Cramer on Mad Money Key Updates: 18A Execution Intel’s 18A yield is improving around 7–8% per month, which Tan described as the industry-standard scale-up rate. Defect-density targets were also reached ahead of year-end, supporting confidence in Panther Lake volume shipments. Foundry Customer Momentum Tan said outside customers are now knocking on Intel’s door after seeing the progress on 18A yield and defect density. He also said Intel has multiple customers engaged on 14A, with a 0.5 PDK already available. 14A Roadmap For 14A, Intel is targeting risk production in 2028 and volume production in 2029, putting it on an equal timeline with TSMC. EMIB / Advanced Packaging EMIB (which he called the best) and advanced packaging may be much bigger than expected …potentially billions, not just hundreds of millions. Some customers are even prepaying to help Intel secure tight supply-chain materials. Customer Demand Demand is accelerating too. Tan said one customer wanted to triple its forecast, but Intel needs a few quarters to catch up. Government Support Tan also said he updates President Trump and Howard Lutnick from time to time, and credited their support for understanding the strategic importance of U.S.-based semiconductor R&D, manufacturing, and capacity. Bottom line: The market can argue over candles. But the actual Intel story is execution, customers, packaging demand, and U.S. strategic backing all moving in the same direction. We don’t own enough $INTC

A2THEZ

34,809 views • 3 months ago

today, intel announced that it will join terafab. terafab started in march as a chip project in austin backed by tesla, spacex, and xai, with the goal of combining logic, memory, and advanced packaging to reach 1 terawatt of compute each year. that gives terafab deeper semiconductor capability as it pushes toward future ai, robotics, and space infrastructure.

today, intel announced that it will join terafab. terafab started in march as a chip project in austin backed by tesla, spacex, and xai, with the goal of combining logic, memory, and advanced packaging to reach 1 terawatt of compute each year. that gives terafab deeper semiconductor capability as it pushes toward future ai, robotics, and space infrastructure.

tetsuo

14,987 views • 4 months ago

We cut open the Kirin 9030 and put it under an electron microscope. The smallest metal pitch measures 32.5 nanometers. That is tighter than Intel 18A, their brand new leading edge node. A Chinese fab with no EUV is out-pitching Intel's EUV node by roughly 10 percent. What's going on here? 🤯 "This is the HiSilicon Kirin 9030, the chip inside Huawei's newest flagship phone. A few weeks ago, we cut it open, put it under an electron microscope, and measured the smallest wires inside the chip, the metal pitch. And what we saw was unexpected. The smallest metal pitch inside the Kirin 9030 measures only 32.5 nanometers. That’s smaller than the metal pitch in Panther Lake, which is based on Intel's brand-new 18A node. A Chinese fab, cut off from the most advanced tools, without EUV, is packing its wires about ten percent tighter than Intel's leading edge EUV node. What’s going on here?"

SemiAnalysis

1,015,314 views • 1 month ago

British man in China couldn't be more excited by how "amazing" and "advanced" it is to be able to pay for things with a biometric palm scan. 🤦‍♂️ "It is the most advanced technology in the world. It's more advanced than facial recognition. It's more advanced than fingerprints. It's amazing!"

British man in China couldn't be more excited by how "amazing" and "advanced" it is to be able to pay for things with a biometric palm scan. 🤦‍♂️ "It is the most advanced technology in the world. It's more advanced than facial recognition. It's more advanced than fingerprints. It's amazing!"

Wide Awake Media

151,375 views • 10 months ago

PsiQuantum is manufacturing America's quantum future. Today, the company announced that we have signed a Letter of Intent with the U.S. Department of U.S. Department of Commerce for $100 million in proposed federal incentives under the CHIPS and Science Act to advance American quantum computing and semiconductor leadership. With this planned funding, combined with PsiQuantum's existing U.S.-anchored supply chain, the company will accelerate the domestic manufacturability and performance of our state-of-the-art components, including Barium Titanate (BTO) for higher-performance optical switches, high-temperature single-photon detectors, and advanced packaging approaches. Learn more:

PsiQuantum is manufacturing America's quantum future. Today, the company announced that we have signed a Letter of Intent with the U.S. Department of U.S. Department of Commerce for $100 million in proposed federal incentives under the CHIPS and Science Act to advance American quantum computing and semiconductor leadership. With this planned funding, combined with PsiQuantum's existing U.S.-anchored supply chain, the company will accelerate the domestic manufacturability and performance of our state-of-the-art components, including Barium Titanate (BTO) for higher-performance optical switches, high-temperature single-photon detectors, and advanced packaging approaches. Learn more:

PsiQuantum

24,568 views • 3 months ago

Elon Musk: For the next few years, I think America is likely to win the artificial intelligence race. But that early lead is fragile and short-lived. Ultimately, the global victor will be decided by a single factor: it will be a function of who controls the AI chip fabrication. The factories that make the AI chips, who controls them? That is where the real power lies. If those facilities are controlled, if more of them are controlled by China, then China will win the future of AI. Right now, almost all the advanced AI chip factories, they call them fabs, are located in Taiwan. That immense concentration of manufacturing creates a massive vulnerability for the rest of the globe. If China invades Taiwan, what happens to the world? Well, if they were to invade in the near term, the entire world would essentially be cut off from advanced AI chips overnight. Everything would grind to a halt. Currently, one hundred percent of advanced AI chips are made in Taiwan. We are relying entirely on a single location for the critical hardware that will define the next era of human technology and military dominance. Bringing that manufacturing power back home and securing our own supply chain is absolutely essential for national security, and the harsh reality is that we are simply not doing enough to prepare.

Elon Musk: For the next few years, I think America is likely to win the artificial intelligence race. But that early lead is fragile and short-lived. Ultimately, the global victor will be decided by a single factor: it will be a function of who controls the AI chip fabrication. The factories that make the AI chips, who controls them? That is where the real power lies. If those facilities are controlled, if more of them are controlled by China, then China will win the future of AI. Right now, almost all the advanced AI chip factories, they call them fabs, are located in Taiwan. That immense concentration of manufacturing creates a massive vulnerability for the rest of the globe. If China invades Taiwan, what happens to the world? Well, if they were to invade in the near term, the entire world would essentially be cut off from advanced AI chips overnight. Everything would grind to a halt. Currently, one hundred percent of advanced AI chips are made in Taiwan. We are relying entirely on a single location for the critical hardware that will define the next era of human technology and military dominance. Bringing that manufacturing power back home and securing our own supply chain is absolutely essential for national security, and the harsh reality is that we are simply not doing enough to prepare.

Ian Miles

409,395 views • 4 months ago

🗣️ New wrong-way driving technology is coming to a road near you. We’re installing one of the most advanced wrong-way driver warning and detection systems in the country on Utah freeways. Check it out in action. 👇

🗣️ New wrong-way driving technology is coming to a road near you. We’re installing one of the most advanced wrong-way driver warning and detection systems in the country on Utah freeways. Check it out in action. 👇

Utah DOT

31,083 views • 3 years ago

This is NVIDIA Rubin. Six new chips designed to deliver one incredible AI supercomputer. Built with extreme codesign across compute, networking, and software, Rubin sets a new standard for building and deploying the most advanced AI systems at the lowest possible cost. #CES2026

This is NVIDIA Rubin. Six new chips designed to deliver one incredible AI supercomputer. Built with extreme codesign across compute, networking, and software, Rubin sets a new standard for building and deploying the most advanced AI systems at the lowest possible cost. #CES2026

NVIDIA Newsroom

31,665 views • 8 months ago

Elon has locked capacity across every major advanced foundry on Earth. TSMC. Samsung on 2nm in Texas. Intel via Tera Fab. This isn’t allocation hunting. It’s building sovereign AI chip infrastructure as Taiwan risks mount. Triple redundancy where the rest of the industry has none. The supply chain moat of the century is taking shape in Austin. *** thanks to David Carbutt and team for the edit

Elon has locked capacity across every major advanced foundry on Earth. TSMC. Samsung on 2nm in Texas. Intel via Tera Fab. This isn’t allocation hunting. It’s building sovereign AI chip infrastructure as Taiwan risks mount. Triple redundancy where the rest of the industry has none. The supply chain moat of the century is taking shape in Austin. *** thanks to David Carbutt and team for the edit

Farzad 🇺🇸 🇮🇷

34,886 views • 4 months ago

🇺🇸 AI is racing toward a wall no algorithm can break through. Global advanced chip production currently covers only 2–3% of what’s needed for Optimus-scale robotics and radiation-hardened orbital computing. Software can keep sprinting, but without a massive leap in manufacturing, logic, memory, and packaging under one roof, the next generation of AI and robots stays grounded. Hardware is the quiet crisis almost no one is shouting about. Writer: Val

🇺🇸 AI is racing toward a wall no algorithm can break through. Global advanced chip production currently covers only 2–3% of what’s needed for Optimus-scale robotics and radiation-hardened orbital computing. Software can keep sprinting, but without a massive leap in manufacturing, logic, memory, and packaging under one roof, the next generation of AI and robots stays grounded. Hardware is the quiet crisis almost no one is shouting about. Writer: Val

Mario Nawfal

45,782 views • 1 month ago