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What's the next step change in chip packaging technology? bubble boi: "The main difference between EMIB and CoWoS is CoWoS relies on what we call silicon interposers. They're like these huge plates where you put the chips on, and you start etching channels in between through the interposers." "An... show more
54,062 görüntüleme • 2 ay önce •via X (Twitter)
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