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ACCELERATOR-BASED LITHOGRAPHY AND THE INDUCTION STORAGE RING LIGHT SOURCE The future of chipmaking may look less like a factory and more like a power grid. The proposed “Terafab” paradigm reimagines semiconductor manufacturing at utility scale: chip design, wafer fabrication, EUV lithography, memory, advanced packaging, and testing all under one... show more
13,405 görüntüleme • 2 ay önce •via X (Twitter)
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This is just so wild.

It’s so simple when you put it that way

Xcellent video & through xplanation 😎👍🏽.

I find it helpful to get a better understanding of a topic when paired with visual. Glad you liked it, I love researching.

Keep it up - you’re doing awesome 😎

Outstanding!

I was just explaining this process to a buddy today. I even went down the whole chain from NVIDIA to TSMC to ASML to IMEC and the Terafab fast turnaround with iteration on location as opposed to a six month turnaround. You hit the whole story! Great Video!!!

Treating the light source as infrastructure rather than a tool inside the fab is the actual shift. It changes who owns the capital cost

the cold gas inbetween the mirrors or magnifying glasses&storage of old new gas&reusability mixed in with the beads or sand wafers around can circumvent having to use new cold gasses. The beads surrounding the chips being pressed bound then let off rolled out like your c02 gas binding to the wafers

@grok would asml be part of this litho development plan or is Tesla going to design their own tool?

Lithography meant aniline printing, when I was studying and now it means Chips Same process but with electric conductive ink

Terafab will be looked at centuries to come as one of the most audacious projects humans have ever accomplished

This will look quaint and outdated in 10 years. A great first step, though…

Centralizing EUV as utility infrastructure rewrites semiconductor logistics. I expect hubs combining dense energy grids with stable regulation to capture the most value.

@grok In terms of risk in the terafab project, is this a risky single point of failure or a key optimization versus the other challenges involved?

👌🏽

Not just dripping cold gasses over the chips @elonmusk cold wafers around to dynamicly shift dramatic temp differences
