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$ASML is upgrading EUV source power to 1,000W lifting throughput to ~330 wafers/hour. That’s a path to ~50% more chip output per tool by 2030.

78,607 次观看 • 4 个月前 •via X (Twitter)

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.Dylan Patel lays out how we know the hard upper bound on how much compute can be produced annually by 2030: around 200 GW/year. That’s a crazy number (there’s about 20 GW of AI deployed in the world right now), but it’s nowhere near enough to satisfy Sam/Elon/Dario/Demis’s ambitions. Lots of things in the supply chain can be scaled up over 4 years, including things that other people think are bottlenecks, like datacenter power or fab clean room space. But the thing that’s inflexible over that timeline is the number of EUV tools. Dylan forecasts that production of ASML’s EUV tools will scale from 60 per year now to about 100 per year by the end of the decade - which means something like 700 total machines running in 2030. For a fab to make a GW worth of the Rubin chips that NVIDIA is deploying later this year, it needs to make 55,000 3nm wafers, 6,000 5nm wafers, and 170,000 memory wafers. Each 3nm wafers needs about 20 EUV passes, so about 1.1 million passes per GW. Adding on 5nm and memory, you need two million passes. Each tool can do 75 passes per hour, so with 90% uptime that’s around 600k passes per year - so a single machine can make less than a third of a GW in a year. So in 2030, we have 700 total machines, each making 0.3ish GW a year, which means we can produce 200 GW of compute a year. That’s a lot. But Sam Altman wants a gigawatt a week by the end of the decade. Anthropic and Google will be wanting about the same. And Elon wants to be putting 100 GW in space every year. Any one of these players could maybe get what they need, but not all of them.

Dwarkesh Patel

114,295 次观看 • 3 个月前