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ASML unveiled an upgrade for the light source in its EUV process that increases power from 600W to 1,000W. This improvement could increase wafer yields by as much as 50% by 2030.

Bearly AI

24,851 subscribers

603,870 Aufrufe • vor 7 Monaten •via X (Twitter)

Wissenschaft & Technologie

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33 Kommentare

Profilbild von Trung Phan

Trung Phanvor 7 Monaten

my fave ASML EUV fact: the Dutch chip machine maker’s light technology is so precise it could hit your thumb with a laser pointer from the moon.

Profilbild von Bearly AI

Bearly AIvor 7 Monaten

That video is from ASML last year: More from Reuters: And no wonder ASML rocks such great merch:

Profilbild von Julian DiCarlo

Julian DiCarlovor 7 Monaten

And they say Europe doesn’t innovate ..

Profilbild von taco

tacovor 7 Monaten

600W to 1000W on a machine that costs $380M per unit. ASML is the final boss of semiconductor manufacturing

Profilbild von Domovinski Duh

Domovinski Duhvor 7 Monaten

Magic light box that makes thinking sand.

Profilbild von Stefan Demetz

Stefan Demetzvor 7 Monaten

They are still using the Russian institute invented/supplied tin laser.

Profilbild von 🌌

🌌vor 7 Monaten

Throughput, not yield.

Profilbild von And1roid🇵🇹

And1roid🇵🇹vor 7 Monaten

That shit is doing magic. How tf someone came up with that

Profilbild von CDU

CDUvor 7 Monaten

Craziest engineering on the planet 🥇

Profilbild von Willis

Willisvor 7 Monaten

That’s impressive.

Profilbild von Nick

Nickvor 7 Monaten

@grok tell us more. Cheaper chips?

Profilbild von Alex

Alexvor 7 Monaten

1kW EUV power bump could really move the yield needle -- 50% by 2030 helps fabs scale AI chips faster. Still, packaging like CoWoS stays the real pinch.

Profilbild von DantePompieri

DantePompierivor 7 Monaten

Yeah I like waffles too

Profilbild von Jedi⚡️

Jedi⚡️vor 7 Monaten

The real leverage is always in the tools behind the scenes.

Profilbild von i8art | deonER

i8art | deonERvor 7 Monaten

@AndreSeverini

Profilbild von L'élite

L'élitevor 7 Monaten

@grok donc pour faire de la lumière ils chauffent de l'étain ? Quel intérêt ?

Profilbild von Larry Panozzo

Larry Panozzovor 7 Monaten

Imagine vibe coding this

Profilbild von Dysputant

Dysputantvor 7 Monaten

All into videos of ntr humanoid cats going to gym. And laughing of sat single mother cat .

Profilbild von Nelson R.

Nelson R.vor 7 Monaten

Sorry, but what does this machine does? What's the big deal about it and the company that builds it?

Profilbild von stream dinner party

stream dinner partyvor 7 Monaten

still using the Russian institute invented/supplied tin laser

Profilbild von Scott Cottonmouth

Scott Cottonmouthvor 7 Monaten

Silly question, but why are the wafers round instead of square or rectangles? Less wasted space that way, no?

Profilbild von Lőrinc Bauer

Lőrinc Bauervor 7 Monaten

😀

Profilbild von Tim Coan

Tim Coanvor 7 Monaten

We are at the beginning of infinity. I’m in constant awe of BUILDERS

Profilbild von AdamHumphreys

AdamHumphreysvor 7 Monaten

Would be cool if they could do that at 2nm.

Profilbild von Estranged Quark

Estranged Quarkvor 7 Monaten

How/why do you think this helps yield? It does improve productivity and thereby the cost per wafer significantly.

Profilbild von ...

...vor 7 Monaten

Changing the light source power will probably never result in "yield" improvements, but it might contribute to other processes which MAY improve marginal yield paretos.

Profilbild von Prikker

Prikkervor 7 Monaten

the Chinese apparently have the blueprints already

Profilbild von 051

051vor 7 Monaten

Nice try. It's fvcked.

Profilbild von Albert Thomas (I observe, I analyze)

Albert Thomas (I observe, I analyze)vor 7 Monaten

Wow

Profilbild von kwant

kwantvor 7 Monaten

Crazy what kind of things you can do by beaming tin drops incredibly accurately

Profilbild von Qwerty

Qwertyvor 7 Monaten

At this point it's just magic,how they work and synchronise each and every motion with light.

Profilbild von Fuck You

Fuck Youvor 7 Monaten

This is big news.

Profilbild von John Mcpherson | MFinPlan, BCom

John Mcpherson | MFinPlan, BComvor 7 Monaten

So bullish

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TerraFab: Tesla + SpaceX + xAI consolidate silicon. One plant. Design → fab → package. Target: 1 TW annual AI compute. ASML High-NA EUV is the choke point $400M machines, multi-year backlog. 2028 volume production is impossible under the current model. Bypass: free-electron laser. Central particle accelerator generates continuous EUV. Split the beam. Photons as a service. One light source feeds the entire floor. X-Light (Pat Gelsinger) commercializing the same tech on the same 2028 timeline. Own the photons. Own the energy. Own the silicon. Decouple AI from legacy tool limits. Orbit-ready radiation-hardened chips become possible. This is vertical integration taken to the light source itself.

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EUV machines are the most complicated tools humans make. Their supply chain has over 10,000 individual suppliers, and any one of them not scaling fast enough can bottleneck the entire AI industry. An EUV tool fires lasers at a tiny tin droplet three times in precise sequence, blasting it hard enough to emit EUV light. That light bounces off 18 multilayer mirrors onto the wafer. Meanwhile, the two platforms inside the machine - one holding the stencil, one holding the chip - are flying back and forth at 9Gs in opposite directions. The successive passes have to land on top of each other to within 3 nanometers. If any part of this is off, yield goes to zero. Take just one component. The mirrors are mostly supplied by Carl Zeiss, who have probably fewer than a thousand people working on them. In turn, Carl Zeiss rely on machines from Switzerland to deposit each of the layers, and use a coating process co-developed with a different German company. None of these companies have woken up. They’re gradually increasing production, but nowhere near the levels necessary for what the labs want by the end of the decade. Dylan Patel predicts production can't scale beyond about 100 EUV machines per year by 2030, no matter how much money gets thrown at the problem. In the medium term this is the key bottleneck on scaling.

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