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ASML unveiled an upgrade for the light source in its EUV process that increases power from 600W to 1,000W. This improvement could increase wafer yields by as much as 50% by 2030.

Bearly AI

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$ASML is upgrading EUV source power to 1,000W lifting throughput to ~330 wafers/hour. That’s a path to ~50% more chip output per tool by 2030.

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