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ASML unveiled an upgrade for the light source in its EUV process that increases power from 600W to 1,000W. This improvement could increase wafer yields by as much as 50% by 2030.

Bearly AI

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603,870 görüntüleme • 7 ay önce •via X (Twitter)

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Trung Phan profil fotoğrafı

Trung Phan7 ay önce

my fave ASML EUV fact: the Dutch chip machine maker’s light technology is so precise it could hit your thumb with a laser pointer from the moon.

Bearly AI profil fotoğrafı

Bearly AI7 ay önce

That video is from ASML last year: More from Reuters: And no wonder ASML rocks such great merch:

Julian DiCarlo profil fotoğrafı

Julian DiCarlo7 ay önce

And they say Europe doesn’t innovate ..

taco profil fotoğrafı

taco7 ay önce

600W to 1000W on a machine that costs $380M per unit. ASML is the final boss of semiconductor manufacturing

Domovinski Duh profil fotoğrafı

Domovinski Duh7 ay önce

Magic light box that makes thinking sand.

Stefan Demetz profil fotoğrafı

Stefan Demetz7 ay önce

They are still using the Russian institute invented/supplied tin laser.

🌌 profil fotoğrafı

🌌7 ay önce

Throughput, not yield.

And1roid🇵🇹 profil fotoğrafı

And1roid🇵🇹7 ay önce

That shit is doing magic. How tf someone came up with that

CDU profil fotoğrafı

CDU7 ay önce

Craziest engineering on the planet 🥇

Willis profil fotoğrafı

Willis7 ay önce

That’s impressive.

Nick profil fotoğrafı

Nick7 ay önce

@grok tell us more. Cheaper chips?

Alex profil fotoğrafı

Alex7 ay önce

1kW EUV power bump could really move the yield needle -- 50% by 2030 helps fabs scale AI chips faster. Still, packaging like CoWoS stays the real pinch.

DantePompieri profil fotoğrafı

DantePompieri7 ay önce

Yeah I like waffles too

Jedi⚡️ profil fotoğrafı

Jedi⚡️7 ay önce

The real leverage is always in the tools behind the scenes.

i8art | deonER profil fotoğrafı

i8art | deonER7 ay önce

@AndreSeverini

L'élite profil fotoğrafı

L'élite7 ay önce

@grok donc pour faire de la lumière ils chauffent de l'étain ? Quel intérêt ?

Larry Panozzo profil fotoğrafı

Larry Panozzo7 ay önce

Imagine vibe coding this

Dysputant profil fotoğrafı

Dysputant7 ay önce

All into videos of ntr humanoid cats going to gym. And laughing of sat single mother cat .

Nelson R. profil fotoğrafı

Nelson R.7 ay önce

Sorry, but what does this machine does? What's the big deal about it and the company that builds it?

stream dinner party profil fotoğrafı

stream dinner party7 ay önce

still using the Russian institute invented/supplied tin laser

Scott Cottonmouth profil fotoğrafı

Scott Cottonmouth7 ay önce

Silly question, but why are the wafers round instead of square or rectangles? Less wasted space that way, no?

Lőrinc Bauer profil fotoğrafı

Lőrinc Bauer7 ay önce

😀

Tim Coan profil fotoğrafı

Tim Coan7 ay önce

We are at the beginning of infinity. I’m in constant awe of BUILDERS

AdamHumphreys profil fotoğrafı

AdamHumphreys7 ay önce

Would be cool if they could do that at 2nm.

Estranged Quark profil fotoğrafı

Estranged Quark7 ay önce

How/why do you think this helps yield? It does improve productivity and thereby the cost per wafer significantly.

... profil fotoğrafı

...7 ay önce

Changing the light source power will probably never result in "yield" improvements, but it might contribute to other processes which MAY improve marginal yield paretos.

Prikker profil fotoğrafı

Prikker7 ay önce

the Chinese apparently have the blueprints already

051 profil fotoğrafı

0517 ay önce

Nice try. It's fvcked.

Albert Thomas (I observe, I analyze) profil fotoğrafı

Albert Thomas (I observe, I analyze)7 ay önce

Wow

kwant profil fotoğrafı

kwant7 ay önce

Crazy what kind of things you can do by beaming tin drops incredibly accurately

Qwerty profil fotoğrafı

Qwerty7 ay önce

At this point it's just magic,how they work and synchronise each and every motion with light.

Fuck You profil fotoğrafı

Fuck You7 ay önce

This is big news.

John Mcpherson | MFinPlan, BCom profil fotoğrafı

John Mcpherson | MFinPlan, BCom7 ay önce

So bullish

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TerraFab: Tesla + SpaceX + xAI consolidate silicon. One plant. Design → fab → package. Target: 1 TW annual AI compute. ASML High-NA EUV is the choke point $400M machines, multi-year backlog. 2028 volume production is impossible under the current model. Bypass: free-electron laser. Central particle accelerator generates continuous EUV. Split the beam. Photons as a service. One light source feeds the entire floor. X-Light (Pat Gelsinger) commercializing the same tech on the same 2028 timeline. Own the photons. Own the energy. Own the silicon. Decouple AI from legacy tool limits. Orbit-ready radiation-hardened chips become possible. This is vertical integration taken to the light source itself.

TerraFab: Tesla + SpaceX + xAI consolidate silicon. One plant. Design → fab → package. Target: 1 TW annual AI compute. ASML High-NA EUV is the choke point $400M machines, multi-year backlog. 2028 volume production is impossible under the current model. Bypass: free-electron laser. Central particle accelerator generates continuous EUV. Split the beam. Photons as a service. One light source feeds the entire floor. X-Light (Pat Gelsinger) commercializing the same tech on the same 2028 timeline. Own the photons. Own the energy. Own the silicon. Decouple AI from legacy tool limits. Orbit-ready radiation-hardened chips become possible. This is vertical integration taken to the light source itself.

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EUV machines are the most complicated tools humans make. Their supply chain has over 10,000 individual suppliers, and any one of them not scaling fast enough can bottleneck the entire AI industry. An EUV tool fires lasers at a tiny tin droplet three times in precise sequence, blasting it hard enough to emit EUV light. That light bounces off 18 multilayer mirrors onto the wafer. Meanwhile, the two platforms inside the machine - one holding the stencil, one holding the chip - are flying back and forth at 9Gs in opposite directions. The successive passes have to land on top of each other to within 3 nanometers. If any part of this is off, yield goes to zero. Take just one component. The mirrors are mostly supplied by Carl Zeiss, who have probably fewer than a thousand people working on them. In turn, Carl Zeiss rely on machines from Switzerland to deposit each of the layers, and use a coating process co-developed with a different German company. None of these companies have woken up. They’re gradually increasing production, but nowhere near the levels necessary for what the labs want by the end of the decade. Dylan Patel predicts production can't scale beyond about 100 EUV machines per year by 2030, no matter how much money gets thrown at the problem. In the medium term this is the key bottleneck on scaling.

EUV machines are the most complicated tools humans make. Their supply chain has over 10,000 individual suppliers, and any one of them not scaling fast enough can bottleneck the entire AI industry. An EUV tool fires lasers at a tiny tin droplet three times in precise sequence, blasting it hard enough to emit EUV light. That light bounces off 18 multilayer mirrors onto the wafer. Meanwhile, the two platforms inside the machine - one holding the stencil, one holding the chip - are flying back and forth at 9Gs in opposite directions. The successive passes have to land on top of each other to within 3 nanometers. If any part of this is off, yield goes to zero. Take just one component. The mirrors are mostly supplied by Carl Zeiss, who have probably fewer than a thousand people working on them. In turn, Carl Zeiss rely on machines from Switzerland to deposit each of the layers, and use a coating process co-developed with a different German company. None of these companies have woken up. They’re gradually increasing production, but nowhere near the levels necessary for what the labs want by the end of the decade. Dylan Patel predicts production can't scale beyond about 100 EUV machines per year by 2030, no matter how much money gets thrown at the problem. In the medium term this is the key bottleneck on scaling.

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