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ASML unveiled an upgrade for the light source in its EUV process that increases power from 600W to 1,000W. This improvement could increase wafer yields by as much as 50% by 2030.

Bearly AI

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603,870 次观看 • 7 个月前 •via X (Twitter)

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33 条评论

Trung Phan 的头像

Trung Phan7 个月前

my fave ASML EUV fact: the Dutch chip machine maker’s light technology is so precise it could hit your thumb with a laser pointer from the moon.

Bearly AI 的头像

Bearly AI7 个月前

That video is from ASML last year: More from Reuters: And no wonder ASML rocks such great merch:

Julian DiCarlo 的头像

Julian DiCarlo7 个月前

And they say Europe doesn’t innovate ..

taco 的头像

taco7 个月前

600W to 1000W on a machine that costs $380M per unit. ASML is the final boss of semiconductor manufacturing

Domovinski Duh 的头像

Domovinski Duh7 个月前

Magic light box that makes thinking sand.

Stefan Demetz 的头像

Stefan Demetz7 个月前

They are still using the Russian institute invented/supplied tin laser.

🌌 的头像

🌌7 个月前

Throughput, not yield.

And1roid🇵🇹 的头像

And1roid🇵🇹7 个月前

That shit is doing magic. How tf someone came up with that

CDU 的头像

CDU7 个月前

Craziest engineering on the planet 🥇

Willis 的头像

Willis7 个月前

That’s impressive.

Nick 的头像

Nick7 个月前

@grok tell us more. Cheaper chips?

Alex 的头像

Alex7 个月前

1kW EUV power bump could really move the yield needle -- 50% by 2030 helps fabs scale AI chips faster. Still, packaging like CoWoS stays the real pinch.

DantePompieri 的头像

DantePompieri7 个月前

Yeah I like waffles too

Jedi⚡️ 的头像

Jedi⚡️7 个月前

The real leverage is always in the tools behind the scenes.

i8art | deonER 的头像

i8art | deonER7 个月前

@AndreSeverini

L'élite 的头像

L'élite7 个月前

@grok donc pour faire de la lumière ils chauffent de l'étain ? Quel intérêt ?

Larry Panozzo 的头像

Larry Panozzo7 个月前

Imagine vibe coding this

Dysputant 的头像

Dysputant7 个月前

All into videos of ntr humanoid cats going to gym. And laughing of sat single mother cat .

Nelson R. 的头像

Nelson R.7 个月前

Sorry, but what does this machine does? What's the big deal about it and the company that builds it?

stream dinner party 的头像

stream dinner party7 个月前

still using the Russian institute invented/supplied tin laser

Scott Cottonmouth 的头像

Scott Cottonmouth7 个月前

Silly question, but why are the wafers round instead of square or rectangles? Less wasted space that way, no?

Lőrinc Bauer 的头像

Lőrinc Bauer7 个月前

😀

Tim Coan 的头像

Tim Coan7 个月前

We are at the beginning of infinity. I’m in constant awe of BUILDERS

AdamHumphreys 的头像

AdamHumphreys7 个月前

Would be cool if they could do that at 2nm.

Estranged Quark 的头像

Estranged Quark7 个月前

How/why do you think this helps yield? It does improve productivity and thereby the cost per wafer significantly.

... 的头像

...7 个月前

Changing the light source power will probably never result in "yield" improvements, but it might contribute to other processes which MAY improve marginal yield paretos.

Prikker 的头像

Prikker7 个月前

the Chinese apparently have the blueprints already

051 的头像

0517 个月前

Nice try. It's fvcked.

Albert Thomas (I observe, I analyze) 的头像

Albert Thomas (I observe, I analyze)7 个月前

Wow

kwant 的头像

kwant7 个月前

Crazy what kind of things you can do by beaming tin drops incredibly accurately

Qwerty 的头像

Qwerty7 个月前

At this point it's just magic,how they work and synchronise each and every motion with light.

Fuck You 的头像

Fuck You7 个月前

This is big news.

John Mcpherson | MFinPlan, BCom 的头像

John Mcpherson | MFinPlan, BCom7 个月前

So bullish

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$ASML is upgrading EUV source power to 1,000W lifting throughput to ~330 wafers/hour. That’s a path to ~50% more chip output per tool by 2030.

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EUV machines are the most complicated tools humans make. Their supply chain has over 10,000 individual suppliers, and any one of them not scaling fast enough can bottleneck the entire AI industry. An EUV tool fires lasers at a tiny tin droplet three times in precise sequence, blasting it hard enough to emit EUV light. That light bounces off 18 multilayer mirrors onto the wafer. Meanwhile, the two platforms inside the machine - one holding the stencil, one holding the chip - are flying back and forth at 9Gs in opposite directions. The successive passes have to land on top of each other to within 3 nanometers. If any part of this is off, yield goes to zero. Take just one component. The mirrors are mostly supplied by Carl Zeiss, who have probably fewer than a thousand people working on them. In turn, Carl Zeiss rely on machines from Switzerland to deposit each of the layers, and use a coating process co-developed with a different German company. None of these companies have woken up. They’re gradually increasing production, but nowhere near the levels necessary for what the labs want by the end of the decade. Dylan Patel predicts production can't scale beyond about 100 EUV machines per year by 2030, no matter how much money gets thrown at the problem. In the medium term this is the key bottleneck on scaling.

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